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QLP manufactures HermeTech™, the semiconductor
industry's first plastic hermetic air cavity package meeting
JEDEC standards. QLP achieved hermetic leak rates of 5x10-8 atm cc/s He or better and passed full Mil Spec reliability through a combination
of its patented UltraSeal™ ultrasonic lid attach technology
and its proprietary Quantech™ material.
UltraSeal™ is an ultrasonic lid attach process
which delivers a robust hermetic seal while significantly reducing
cycle time.
Quantech™ is a proprietary material that
can be tailored to meet specific properties and performance requirements.
Quantech™'s properties enable QLP to manufacture HermeTech™ QFNs that feature tailorable CTE, tailorable electrical
properties, ultra-low moisture permeability, high temperature
stability and excellent adhesion to metal.
QLP's packaging technology is built on a revolutionary
material, Quantech™, engineering design, and proprietary
process technology.
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