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QLP’s air cavity SOIC packages
are designed for low stress performance with the ability to
withstand harsh environments such as intense shock and vibration,
extreme temperatures, and severe humidity.
 SOIC Package Features
- Tailorable CTE (3-21 ppm/°C)
- High temperature stability (500°C)
- High performance Cu alloy and Alloy 42 lead
frames
- Tailorable electrical properties
- Ultra-low moisture permeability
- Injection molded
SOIC Package Benefits
- Low stress packaging
- High thermal performance
- High reliability MSL 1 condition
- Low dielectric constant and low electrical loss
- Pb-free 260°C compatible
- Tight mechanical tolerances
SOIC Package Configurations
For configuration information please contact us or call 978.253.6153.
Lead Frame Options
Plating Options
SOIC Markets and Applications
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