| QLP’s air cavity QFN products
meet the performance requirements of demanding semiconductor
packaging, delivering significant advantages over alternative
metal and ceramic packages. These
packages are low-stress and are able to withstand harsh environments
such as intense shock and vibration, extreme temperatures,
and severe humidity.
 QFN Package Features
- Tailorable CTE (3-21 ppm/°C)
- High temperature stability (500°C)
- High performance Cu alloy and Alloy 42 lead
frames
- Tailorable electrical properties
- Ultra-low moisture permeability
- Injection molded
QFN Package Benefits
- Low stress packaging
- High thermal performance
- High reliability MSL 1 condition
- Low dielectric constant and low electrical
loss
- Pb-free 260°C compatible
- Tight mechanical tolerances
QFN Package Configurations
Maximum Lead Counts
for
QFN Packages |
Package Size |
Max Lead Count |
4x4
|
16
|
5x5
|
24
|
6x6
|
36
|
7x7
|
44
|
8x8 |
48 |
For further information please contact us or
call 978.253.6153.
 Lead Frame Options
Plating Options
QFN Markets and Applications
Any device that requires
an air cavity package. Call 978.253.6153 for details. |
