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QLP's LDMOS packages meet the high-performance requirements
of RF power applications. Unlike traditional ceramic LDMOS packages,
QLP's completely assembled package incorporates a copper flange
that delivers greater thermal and improved reliability performance
over current ceramic designs.
 LDMOS Package Features
- High temperature stability (500°C)
- Tailorable
CTE (3-21 ppm/°C)
- Excellent adhesion to copper and other metals
- Low
shrinkage
- Tight dimensional tolerances
- Injection molded
package
- Ultra-low moisture permeability
LDMOS Package Benefits
- Supports high-temperature eutectic die-attach
processes for improved thermal performance
- Enables copper flange assembly for improved
thermal conductivity and lower junction temperature for greater
reliability performance
- Achieves flatter flange assembly, reducing backside
stress and improving die attach yield
- Meets MIL-SPEC hermetic performance
 LDMOS Markets and Applications
- High Power Amplifiers
- RF & Microwave
- Gallium Arsenide/Gallium Nitride
- Silicon Germanium
- Silicon on Insulator
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