QLP's HermeTech™ QFN is the industry's first and only plastic QFN offering true hermetic performance. HermeTech™ QFN achieves leak rates of 5x10^-8 atm cc/s He or better and passes full Mil Spec reliability.

QLP’s hermetic air cavity QFN products meet the performance requirements of demanding semiconductor packaging while delivering significant design, material property and assembly advantages over ceramic hermetic packages.

QLP's HermeTech™ QFN packages are low-stress and withstand harsh environments such as intense shock and vibration, extreme temperatures, and severe humidity.

HermeTech™ QFN Package Features

• Hermetic leak rates of 5x10^-8 atm cc/s He or better
• Passes full Mil Spec reliability tests
• Tailorable CTE (3-21 ppm/°C)
• High temperature stability (500°C)
• High performance Cu alloy and Alloy 42 lead frames
• Tailorable electrical properties
• Ultra-low moisture permeability
• Injection molded

HermeTech™ QFN Package Benefits

• Design flexibility
• Low stress packaging
• High thermal performance
• High reliability MSL 1 condition
• Low dielectric constant and low electrical loss
• Pb-free 260°C compatible
• Tight mechanical tolerances

HermeTech™ QFN Package Configurations

For further information please contact us or call 978.253.6153.

Lead Frame Options

• Cu Alloy
• Alloy 42

Plating Options

• NiPdAu
• NiAu
• Spot Ag

HermeTech™ QFN Markets and Applications

• RF & Microwave
• MEMS
• HB-LEDs
• Analog Packaging

Any device that requires an air cavity package. Call 978.253.6153 for details.