Quantum Leap Packaging, Inc. (QLP) developed HermeTech™, the industry's first true plastic hermetic package, achieving a design and manufacturing breakthrough long sought by the packaging industry.

QLP designs and manufactures hermetic and near-hermetic high-performance air-cavity packages utilizing a revolutionary proprietary polymer - Quantech™. Quantech™ can be tailored to meet specific package reliability and performance requirements such as low stress, thermal conductivity, and high frequency capability. QLP’s air cavity packages are designed for a variety of applications including Optical Electronics Systems, Image Sensors, HB-LEDs, MEMs, and High Power RF-Microwave assembly.

QLP began in 2002 with a mission to solve longstanding semiconductor packaging problems using a proprietary polymer technology, Quantech™.

Quantech™ material technology enables QLP to solve critical issues faced by manufacturers. It is extremely stable at high temperatures and can be tailored to meet specific properties. These properties enable QLP to deliver unique package characteristics that improve reliability, thermal and electrical performance.

At their Wilmington, MA facility, engineers design packages to satisfy customer's requirements. These air cavity packages are manufactured on-site using unique injection molding processes.

QLP combines innovative material technology, engineering design, and high-yield process technology to develop solutions to real world packaging problems.