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QLP's innovative Connector in
Package (CiP), designed for LCOS (liquid crystal on silicon)
assembly and applications requiring remotely deployed chips,
provides significant advantages over traditional chip-on-flex
assembly. CiP technology delivers higher yields and greater design
flexibility.
 CiP Features
- Integrated connector, substrate,
mounting features and components
- Molded package features
- Tight dimensional control
- Standard semiconductor
assembly processes
CiP Benefits
- Significantly increases yield
- Improves in-field
serviceability and testing
- Enables accurate alignment and
assembly
- Allows greater design flexibility
- Increases
throughput
- Greater
I/O capability
CiP Specifications
CiP Product Information Sheet
For further information please contact us or
call 978.253.6153.
CiP Markets and Applications
- Rear Projection TVs and Projectors
- Displays
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