QUANTUM LEAP PACKAGING, INC. TO RECEIVE $20 MILLION EQUITY INVESTMENT FROM SUMITOMO CHEMICAL

Japanese Leading Chemical Company Augments Well-Established Position in Electronics Sector with Equity Position in U.S Company Leading Innovation in Semiconductor Packaging

WILMINGTON, MA - November 9, 2005 - Quantum Leap Packaging, Inc., (QLP), a leading provider of high performance electronic component packaging utilizing proprietary Quantech™ Liquid Crystal Polymer (LCP) compounds, today announced that Sumitomo Chemical Co., Ltd. (Sumitomo) of Japan will acquire an equity position in the company. Sumitomo will obtain a 20% interest in QLP through the purchase of newly issued shares of privately-held QLP stock.

Sumitomo, with annual revenues of $12 billion, is one of Japan's leading chemical manufacturers, offering a diverse range of products. Their IT Related Chemical Sector is a leader in polarizing film, color filters, photoresists, MOEPI wafers, sputtering targets and LCP.

As part of a new strategic business initiative, Sumitomo's IT Related Chemical Sector has been actively expanding their interests in LCP technology due to growing industry demand for high quality electronic packaging alternatives. Through the equity-stake transaction with QLP, a technological leader and innovator in LCP materials and manufacturing processes, Sumitomo will be able to reduce their own research and development cycles, and obtain immediate access to the burgeoning market. Terms of the agreement note that Sumitomo will work closely with QLP to further develop the market for LCP packaging technologies, primarily in Japan and Korea, under a non-exclusive distributorship right to be granted by QLP.

"We are pleased to have Sumitomo, an established world leader in supplying materials to the semiconductor and display market, as a strategic partner," said Jim LaCasse, CEO of Quantum Leap Packaging, Inc. "Their interest and investment in Quantum Leap Packaging further validates our technology and strengthens our position in the global market, allowing us to focus on further innovations in next generation packaging solutions."

Since establishment in December 2002, Quantum Leap Packing, Inc. (QLP) has been developing high performance component packaging and substrates based on high molecular weight polymers and LCP technology. Utilizing unconventional, patented technology, QLP has successfully developed LCP-compounded resin, a material now branded as Quantech.™ Unlike standard, prolific LCP materials, QLP's patented Quantech™ material technology offers isotopic properties, extremely high temperature stability, and tailor-able Coefficient of Thermal Expansion (CTE), enabling superior thermal and electrical performance. These features match, or in some instances exceed, the performance levels of incumbent ceramic materials while offering a lower cost of ownership through reduced assembly costs and faster throughput. QLP utilizes state-of-the-art technology to incorporate Quantech™ into custom semiconductor packages. Target markets include MEMS, LEDs, RF-Microwave High Frequency, and High Power applications.

About Quantum Leap Packaging
Quantum Leap Packaging, Inc. designs and manufactures electronic component packaging utilizing proprietary Quantech™ Liquid Crystal Polymer (LCP) compounds. Quantum Leap's unique material system meets the critical design and manufacturing requirements of a variety of applications such as Semiconductor, Medical and Optical devices, RF-Microwave and LDMOS, either in hermetic or non-hermetic configurations. As a packaging replacement for traditional metal or ceramic materials, Quantum Leap's Quantech™ compounds deliver significant performance enhancements with a greatly reduced total cost of ownership. Incorporated in December 2002, Quantum Leap Packaging is backed by leading venture firm, Battery Ventures. For more information, please visit our website at www.qlpkg.com.