Industry Veteran Appointed to Lend Expertise to High Performance Electronic Component Packaging Manufacturer Aiming to Replace Incumbent Ceramic Packaging Technology

WILMINGTON, MA - September 19, 2005 - Quantum Leap Packaging, a leading provider of high-performance electronic component packaging utilizing a proprietary Quantech™ Liquid Crystal Polymer (LCP) compound, today announced that David Grooms has been appointed to its Board of Directors. Grooms was previously president of Kyocera America, Inc. and Kyocera Mexicana S.A.de C.V., having served a twenty year tenure there.

"David has a wealth of semiconductor package manufacturing expertise, with significant international experience and a strong, strategic business orientation," said Jim LaCasse, CEO of Quantum Leap Packaging. "Quantum Leap is uniquely positioned to propel semiconductor packaging into the next phase of innovation by offering high-performance packaging solutions that will replace costly ceramic materials. His appointment is a tremendous asset to the company."

In his distinguished career, Grooms has held the top post at several large public and small emerging technology companies to include President of Kyocera America, Inc. and Kyocera Mexicana S.A.de C.V., both based out of San Diego, CA. In 2001, Grooms became Acting President and CEO of Shellcase, Inc., a provider of MEMs, optical sensors and micro camera modules used for cellular phone applications. Mr. Grooms was also the Chief Executive Officer of Zucotto Wireless, Inc., a Java microprocessor company focused on the wireless phone market.

Grooms earned his B.A. from Bowling Green State University. He currently serves on a number of other corporate boards and associations to include the Center for Wireless Communications at UCSD, the Manufacturing Advisory Council at the San Diego State College of Engineering, The Microwave, Optical and Digital Electronics Technical Advisory Board at the University of Colorado, Dock3, Silicon Logic Engineering and TSR Technologies. He is a resident of La Jolla, California.

About Quantum Leap Packaging
Quantum Leap Packaging designs and manufactures electronic component packaging utilizing a proprietary Quantech™ Liquid Crystal Polymer (LCP) compound. Quantum Leap's unique LCP material system meets the critical design and manufacturing requirements of a variety of applications such as Semiconductor, Medical and Optical devices, RF-Microwave and LDMOS, either in hermetic or non-hermetic configurations. As a packaging replacement for traditional metal or ceramic materials, Quantum Leap's Quantech™ LCP compound delivers a significant reduction in cost with no sacrifice to performance. Incorporated in December 2002, Quantum Leap is headquartered in a 32,000 square foot facility at 200 Research Drive, Wilmington, MA 01887. For more information, please visit our website at www.qlpkg.com.