QUANTUM LEAP PACKAGING APPOINTS DAVID GROOMS AS CEO

WILMINGTON, MA - September 12, 2006 - Quantum Leap Packaging, Inc. (QLP) a leading provider of high-performance electronic component packaging utilizing Quantech™ proprietary polymers, is pleased to announce the appointment of David Grooms to Chief Executive Officer.

"QLP is entering a new phase of global expansion where we need to quickly ramp volume manufacturing, develop second sources around the world, and support Sumitomo, our strategic partner in Japan," said Mike Zimmerman, Founder and CTO of Quantum Leap Packaging. "David brings years of expertise in the packaging industry, from the Sales, Marketing and Manufacturing sides. In addition, he has in-depth experience with the Japanese market, which is a core focus for us. We have made tremendous progress already against our goals of transforming semiconductor packaging, and I welcome David's leadership to help continue our momentum and accelerate our global expansion."

In his distinguished career, Grooms has held the top post at several large public and small emerging technology companies to include President of Kyocera America, Inc. and Kyocera Mexicana S.A.de C.V., both based out of San Diego, CA, where he served a twenty year tenure.

About Quantum Leap Packaging Inc.

Quantum Leap Packaging, Inc. designs and manufactures semiconductor and electronic packaging for applications such as HB-LEDs, MEMs, and RF-Microwave assembly. Quantum Leap's revolutionary QuantechTM material system solves critical thermal, stress and reliability issues faced in semiconductor packaging. For more information, please refer to www.qlpkg.com.