Quantum Leap Packaging Adds Second Manufacturing Site

WILMINGTON, MA - August 23, 2007 - Quantum Leap Packaging, Inc. (QLP), a leading provider of high performance air cavity packages for semiconductor assembly, announced today that it has added a second manufacturing site in Poway, California.

QLP plans to manufacture in its new Poway site by early 2008. The new 18,000 square foot facility will provide QLP with much needed capacity to support growing demand and provide product service and support to its Wilmington, Massachusetts facility.

"We are pleased to expand our manufacturing capabilities and support our products' rapid growth," said David Grooms, CEO of QLP. "Our Poway site brings us closer to our customers, ensures that our customers’ orders are delivered on time, and satisfies our need for a second manufacturing site."

QLP has experienced significant growth in both its power amplifier packages and hermetic air cavity packages since developing HermeTech™, the industry's first true plastic hermetic package. QLP achieved this long sought design and manufacturing breakthrough by combining QLP's innovative Quantech™ material, engineering design and proprietary process technology.

About Quantum Leap Packaging Inc.

Quantum Leap Packaging, Inc. designs and manufactures high-performance hermetic and near-hermetic air cavity packages for applications such as Optical Electronics Systems, Image Sensors, HB-LEDs, MEMs, and High Power RF-Microwave assembly. Quantum Leap's revolutionary Quantech™ material system solves critical thermal, stress and reliability issues faced in semiconductor packaging.

QLP developed HermeTech™, the industry's first true plastic hermetic package, in a design and manufacturing breakthrough long sought by the industry. The breakthrough was made possible by the combination of QLP's innovative Quantech™ material, engineering design, and proprietary process technology.