Quantum Leap Packaging Appoints Roger Kuroda Senior VP of Manufacturing

WILMINGTON, MA - July 11, 2007 - Quantum Leap Packaging, Inc. (QLP) a leading provider of high performance semiconductor packaging, is pleased to announce the appointment of Roger Kuroda, Ph.D. as Senior Vice President of Manufacturing.

"QLP is in the midst of ramping manufacturing and moving several products into production. Roger brings a deep manufacturing and engineering background necessary to lead QLP’s manufacturing strategy,” said CEO David Grooms. "Roger will have a leadership role in accelerating our manufacturing ramps and satisfying our customer demand. His appointment will have significant impact on QLP’s expansion."

Kuroda brings to QLP years of experience in the semiconductor packaging industry as well as other advanced technologies. He has held senior positions in manufacturing, engineering and R&D where he had responsibility for design, assembly and packaging. Prior to QLP, Roger was VP of Engineering at XCOM Wireless, responsible for designing RF MEMS devices, foundry management, project management and developing and qualifying new assembly and packaging. He was also VP of Manufacturing and Technology at Shellcase, responsible for wafer level packaging for optical sensors and micro camera modules. Previously, Kuroda was Flip Chip Packaging Division Manager and R&D Center Manager at Kyocera America, where he was responsible for developing new packages for customers. Roger started his career at TRW Inc. where he held several positions in thick film production, program and proposal management.

Kuroda has a B.S. in Applied Physics from UC Davis with specialties in Material Science and Chemistry, a M.S. and Ph.D. from the University of Southern California in Physics, and has numerous publications and patents.

About Quantum Leap Packaging Inc.

Quantum Leap Packaging, Inc. designs and manufactures high-performance hermetic and near-hermetic air cavity packages for applications such as Optical Electronics Systems, Image Sensors, HB-LEDs, MEMs, and High Power RF-Microwave assembly. Quantum Leap's revolutionary Quantech™ material system solves critical thermal, stress and reliability issues faced in semiconductor packaging.

QLP developed HermeTech™, the industry's first true plastic hermetic package, in a design and manufacturing breakthrough long sought by the industry. The breakthrough was made possible by the combination of QLP's innovative Quantech™ material, engineering design, and proprietary process technology.