Quantum Leap Packaging Announces the Next Generation of Organic Semiconductor Packaging

Wilmington, MA – April 3 - Quantum Leap Packaging, Inc (QLP) announces the next generation of organic semiconductor and electronic packaging. QLP's proprietary Quantech™ polymer compounds produce unique advantages in RF Microwave packaging. These designs increase performance and improve thermal dissipation by tailoring material properties such as dielectric constant, CTE and adhesion to copper flanges. QLP's packaging provides high temperature stability enabling eutectic die attach processes and complies with the latest RoHS environmental standards.

About Quantum Leap Packaging Inc.

Quantum Leap Packaging, Inc. designs and manufactures semiconductor and electronic packaging utilizing proprietary Quantech™ polymer compounds. Quantum Leap's unique material system meets the critical design and manufacturing requirements of semiconductor packaging applications such as HB-LEDs, MEMs, RF-Microwave devices and Displays.