Quantum Leap Packaging, Inc. (QLP) designs and manufactures high performance hermetic and near-hermetic air cavity packages for semiconductor assembly. Utilizing injection mold technology and Quantech™, a proprietary polymer that can be tailored to meet specific properties, QLP offers a variety of package configurations such as SOIC, QFN, and LDMOS packages as well as custom designs that improve reliability and operating performance.

QLP has developed HermeTech™, the industry's first true plastic hermetic package in a design and manufacturing breakthrough long sought by the industry. The breakthrough was made possible by the combination of QLP's innovative Quantech™ material, engineering design, and proprietary process technology.